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  ? semiconductor components industries, llc, 2006 december, 2006 ? rev. 3 1 publication order number: mc74act640/d mc74act640 octal 3?state inverting transciever the mc74act640 octal bus tr ansceiver is designed for asynchronous two-way communication between data buses. the device transmits data from bus a to bus b when t/r = high, or from bus b to bus a when t/r = low. the enable input can be used to disable the device so the buses are effectively isolated. features ? bidirectional data path ? a and b outputs sink 24 ma/source ?24 ma ? ttl compatible inputs ? pb?free packages are available* 19 20 18 16 15 14 2 1 34567 v cc 13 8 12 9 11 10 oe b 0 b 1 b 2 b 3 b 4 b 5 b 6 b 7 t/r a 0 a 1 a 2 a 3 a 4 a 5 a 6 a 7 gnd 17 figure 1. pinout: 20?lead packages conductors (top view) pin assignment pin function a 0 ?a 7 side a inputs or 3-state outputs oe output enable input t/r transmit/receive input b 0 ?b 7 side b inputs or 3-state outputs truth table oe t/r applied inputs valid direction i/p o/p output h x x x x l h h a to b l l h l a to b h l l h b to a l l l l b to a h h = high voltage level l = low voltage level x = immaterial *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. see general marking information in the device marking section on page 4 of this data sheet. device marking information http://onsemi.com soic?20w dw suffix case 751d soeiaj?20 m suffix case 967 1 1 pdip?20 n suffix case 738 1 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. device package shipping ? ordering information mc74act640n pdip?20 18 units/rail mc74act640ng pdip?20 (pb?free) 18 units/rail mc74act640dw soic?20 38 units/rail mc74act640dwg soic?20 (pb?free) 38 units/rail mc74act640dwr2 soic?20 1000 / tape & reel mc74act640dwr2g soic?20 (pb?free) 1000 / tape & reel mc74act640mel soeiaj?20 2000 / tape & reel MC74ACT640MELG soeiaj?20 (pb?free) 2000 / tape & reel
mc74act640 http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage  0.5 to  7.0 v v i dc input voltage  0.5  v i  v cc  0.5 v v o dc output voltage (note 1)  0.5  v o  v cc  0.5 v i ik dc input diode current  20 ma i ok dc output diode current  50 ma i o dc output sink/source current  50 ma i cc dc supply current per output pin  50 ma i gnd dc ground current per output pin  50 ma t stg storage temperature range  65 to  150  c t l lead temperature, 1 mm from case for 10 seconds 260  c t j junction temperature under bias  150  c  ja thermal resistance pdip soic 67 96  c/w p d power dissipation in still air at 85  c pdip soic 750 500 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 30% ? 35% ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) > 2000 > 200 > 1000 v i latchup latchup performance above v cc and below gnd at 85  c (note 5)  100 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. i o absolute maximum rating must be observed. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to jesd22?c101?a. 5. tested to eia/jesd78. recommended operating conditions symbol parameter min typ max unit v cc dc input voltage (referenced to gnd) 4.5 5.5 v v in , v out dc input voltage, output voltage (referenced to gnd) 0 v cc v t a operating temperature, all package types ?40 25 +85 c t r , t f input rise and fall time (note 7) v cc = 4.5 v v cc = 5.5 v 0 0 10 8.0 10 8.0 ns/v t j junction temperature (pdip) 140 c i oh output current ? high ?24 ma i ol output current ? low 24 ma 6. unused inputs may not be left open. all inputs must be tied to a high voltage level or low logic voltage level. 7. v in from 0.8 v to 2.0 v; refer to individual data sheets for devices that differ from the typical input rise and fall times.
mc74act640 http://onsemi.com 3 dc characteristics symbol parameter v cc (v) t a = +25  c t a = ?40  c to +85  c unit conditions typ guaranteed limits v ih minimum high level i nput voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 v v v out = 0.1 v or v cc ? 0.1 v v il maximum low level input voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 v v v out = 0.1 v or v cc ? 0.1 v v oh minimum high level output voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 v v i out = ?50  a 4.5 5.5 3.86 4.86 3.76 4.76 v v *v in = v il or v ih ?24 ma i oh ?24 ma v ol maximum low level output voltage 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 v v i out = 50  a 4.5 5.5 0.36 0.36 0.44 0.44 v v *v in = v il or v ih ?24 ma i oh ?24 ma i in maximum input leakage current 5.5 0.1 1.0  a v i = v cc , gnd  i cct additional max. i cc /input 5.5 0.6 1.5 ma v i = v cc ? 2.1 v i oz maximum 3?state current 5.5 0.5 5.0  a v i (oe) = v il , v ih v i = v cc , gnd v o = v cc , gnd i old i ohd ?minimum dynamic output current 5.5 5.5 75 ?75 ma ma v old = 1.65 v max i cc maximum quiescent supply current 5.5 8.0 80  a v in = v cc or gnd *all outputs loaded; thresholds on input associated with output under test. ?maximum test duration 2.0 ms, one output loaded at a time. ac characteristics t r = t f = 3.0 ns (for figures and waveforms, see figures 2 and 3.) symbol parameter v cc * (v) t a = +25  c c l = 50 pf t a = ?40  c to +85  c c l = 50 pf unit min max min max t plh propagation delay an to bn or bn to an 5.0 1.5 8.0 1.0 8.5 ns t phl propagation delay an to bn or bn to an 5.0 1.5 8.0 1.0 9.0 ns t pzh output enable time oe to an or bn 5.0 1.5 10.0 1.0 11.0 ns t pzl output enable time oe to an or bn 5.0 1.5 10.0 1.0 11.0 ns t phz output disable time t/r or oe to an or bn 5.0 1.5 10.0 1.0 11.0 ns t plz output disable time t/r or oe to an or bn 5.0 1.5 10.0 1.0 11.0 ns *voltage range 5.0 v is 5.0 v 0.5 v capacitance symbol parameter value typ unit test conditions c in input capacitance 4.5 pf v cc = 5.0 v c i/o input/output capacitance 15 pf v cc = 5.0 v c pd power dissipation capacitance 45 pf v cc = 5.0 v
mc74act640 http://onsemi.com 4 switching waveforms 10% figure 2. figure 3. *includes all probe and jig capacitance c l * 50  scope test point device under test output figure 4. test circuit 450  input 3.0 v gnd 50% 50% input a or b output a or b t plh t phl 90% 10% 90% t thl t tlh t r t f 50% 50% 50% gnd v ol v oh a or b a or b t pzl t plz t pzh t phz high impedanc e oe 10% 90% high impedanc e 3.0 v 3.0 v gnd t/r marking diagrams pdip?20 soic?20w soeiaj?20 1 20 mc74act640n awlyywwg a = assembly location wl = wafer lot yy, y = year ww = work week g = pb?free package 20 1 74act640 awlywwg 20 1 act640 awlyywwg
mc74act640 http://onsemi.com 5 package dimensions pdip?20 n suffix plastic dip package case 738?03 issue e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension b does not include mold flash. m l j 20 pl m b m 0.25 (0.010) t dim min max min max millimeters inches a 25.66 27.17 1.010 1.070 b 6.10 6.60 0.240 0.260 c 3.81 4.57 0.150 0.180 d 0.39 0.55 0.015 0.022 g 2.54 bsc 0.100 bsc j 0.21 0.38 0.008 0.015 k 2.80 3.55 0.110 0.140 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.01 0.020 0.040   e 1.27 1.77 0.050 0.070 1 11 10 20 ?a? seating plane k n f g d 20 pl ?t? m a m 0.25 (0.010) t e b c f 1.27 bsc 0.050 bsc soic?20w dw suffix case 751d?05 issue g 20 1 11 10 b 20x h 10x c l 18x a1 a seating plane  h x 45  e d m 0.25 m b m 0.25 s a s b t e t b a dim min max millimeters a 2.35 2.65 a1 0.10 0.25 b 0.35 0.49 c 0.23 0.32 d 12.65 12.95 e 7.40 7.60 e 1.27 bsc h 10.05 10.55 h 0.25 0.75 l 0.50 0.90  0 7 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. dimensions d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include dambar protrusion. allowable protrusion shall be 0.13 total in excess of b dimension at maximum material condition. 
mc74act640 http://onsemi.com 6 package dimensions soeiaj?20 m suffix case 967?01 issue a dim min max min max inches ??? 2.05 ??? 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.15 0.25 0.006 0.010 12.35 12.80 0.486 0.504 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 ??? 0.81 ??? 0.032 a 1 h e q 1 l e  10  0  10  notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). h e a 1 l e q 1  c a z d e 20 110 11 b m 0.13 (0.005) e 0.10 (0.004) view p detail p m l a b c d e e l m z on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 mc74act640/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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